AI Hardware & Chips: Daily News · 9 Oct 2026 · 5 min

AMD's 245x Multiple, Firmus IPO Collapse & GlobalFoundries' $2B Packaging Deal

AMD's data center revenue doubled but its 245x earnings multiple demands near-flawless execution — here's what investors and engineers need to watch. Plus: a $5B AI infrastructure IPO quietly withdrawn, HPE goes all-in on EPYC, and GlobalFoundries locks in $2B of US packaging capacity.

AI Hardware & Chips: Daily News
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AMD's 245x Multiple, Firmus IPO Collapse & GlobalFoundries' $2B Packaging Deal

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What's covered

AMD's Trillion-Dollar Valuation Problem

AMD's Data Center revenue just doubled in a single quarter. And yet the company's valuation is the thing that's keeping analysts up at night.

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Firmus IPO Withdrawal Signal

While AMD's growth narrative holds together for now, the public markets are sending a different signal elsewhere. Firmus, an Nvidia-backed Australian AI infrastructure firm, just pulled a five-billion-dollar IPO.

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GlobalFoundries Two-Billion Packaging Deal

Away from public market noise, something more structurally important just became contractual. GlobalFoundries has signed a two-billion-dollar multi-year deal to produce silicon interposers at its Malta, New York facility.

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HPE Commits Fully to AMD EPYC

HPE has launched four new ProLiant Gen13 servers, all built on AMD's sixth-generation EPYC processors. The DL525 offers two hundred and fifty-six cores in a single socket.

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Verano's AI-First Architecture Split

AMD is also quietly fragmenting its server CPU line. The upcoming Verano processor, based on Zen six architecture, uses a new SB1 socket, carries seventy-two cores, and runs on a twenty-four-channel LPDDR5X memory subsystem.

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Qualcomm's Edge AI Counter-Move

One more development worth tracking. Qualcomm's CEO is pushing back on the idea that AI makes smartphones obsolete.

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Key Watchpoints

The through-line across all of this is AMD's balancing act. Strong fundamentals, real customer commitments, and OEM confidence.

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