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TSMC's CoW Opens Up, Anthropic's Custom Chip & AMD's 107% Surge
Audio is available on Spreaker — see link below.
TSMC breaks its Chip-on-Wafer monopoly by outsourcing to ASE, reshaping the AI packaging supply chain overnight. Plus: Anthropic enters custom silicon, AMD data center revenue doubles, and Intel 18A hits full production.
Audio is available on Spreaker — see link below.
TSMC is opening up its Chip-on-Wafer packaging process to outside manufacturers, and that single decision may do more to ease the AI chip supply crunch than anything else in the pipeline right now. For context, CoWoS is the two-step packaging architecture that connects GPU and AI processors to high-bandwidth memory via a silicon interposer.
The first place those effects land is with the equipment suppliers. South Korean firms, Hanmi Semiconductor, Avaco, and Wonik, are positioned directly in front of this wave.
While the packaging story reshapes supply, Anthropic is making a move that reshapes demand. The company confirmed an in-house chip design team with a co-design strategy aimed at cutting Claude inference costs by fifty percent.
AMD's quarterly numbers deserve attention in this context. Data center revenue came in at six point seven billion dollars, up one hundred and seven percent year over year.
Intel's story this cycle is simpler to state and harder to evaluate. The eighteen-A process is in full production.
Three things to keep close. Whether ASE's CoW ramp delivers yield at scale.
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