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Vera CPU Benchmarks, TSMC Price Surge & China's Silicon Moment | Jun 2-5
Audio is available on Spreaker — see link below.
Nvidia's Vera CPU posts a 63% benchmark leap over Grace while TSMC hikes 3nm wafer prices above $23,000 — and Chinese automakers are shipping custom silicon at volume. Three chip CEOs converge at COMPUTEX 2026 as the AI hardware race enters a new phase.
Audio is available on Spreaker — see link below.
Jensen Huang, Lisa Su, and Intel's Lip-Bu Tan are all in Taiwan this week, and that convergence tells you everything you need to know about where the semiconductor industry stands right now. COMPUTEX 2026 runs June second through fifth in Taipei, and it's rare to have three chip CEOs in the same place at the same time.
Now to the result that landed this week and immediately changed the data-center conversation. NVIDIA's Vera CPU, built on eighty-eight Olympus ARM cores, posted a sixty-three percent performance gain over its predecessor Grace in Phoronix benchmarks.
The story that deserves more attention than it's getting is what's happening in Chinese consumer and automotive silicon. Xiaomi's XRING O1 is a three-nanometer chip now shipping in volume, with over one million units sold.
The market this week validated the structural argument. Micron surged seventeen percent after a UBS call projecting over one hundred percent upside on long-term supply contracts.
The near-term signals worth tracking are clear. AMD's Venice two-nanometer ramp in the second half of twenty twenty-six is the direct answer to Vera, and its timeline against TSMC's capacity constraints is still undefined.
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