AI Hardware & Chips: Daily News · 18 Jun 2026 · 5 min

China's Chip Market Sealed, Intel 18A-P & CME Compute Futures

Beijing has permanently closed China's AI chip market to US vendors — and the export control architecture that was meant to contain it helped cause it. Today's briefing covers Intel's 18A-P foundry gamble, Oracle's 97.5% GPU utilization signal, AMD's Rackspace enterprise play, CME's AI compute futures, and Rumble's Northern Data acquisition.

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China's Chip Market Sealed, Intel 18A-P & CME Compute Futures

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What's covered

China's Permanent US Chip Block

Beijing has permanently closed China's AI chip market to American vendors. Not restricted.

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Intel 18A-P Foundry Gamble

Elsewhere in the hardware stack, Intel moved its 18A-P node into risk production. That's a meaningful step.

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Oracle GPU Saturation Signal

Oracle disclosed ninety-seven point five percent GPU utilization across its global data centers last quarter. That number is effectively a ceiling.

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AMD Rackspace Enterprise Deal

AMD and Rackspace signed a multi-year agreement to build thirty megawatts of AMD-powered data center capacity, targeting regulated sector workloads including healthcare. This is AMD competing on managed solutions, not just GPU commodity pricing.

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CME AI Compute Futures Launch

CME Group and Silicon Data are developing what would be the world's first AI compute futures contracts. ProShares and Rex Shares have already filed for leveraged ETF products.

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Rumble Northern Data Consolidation

Rumble closed its acquisition of Northern Data, gaining over two hundred megawatts of unmonetized energy capacity and roughly twenty-two thousand NVIDIA H100 and H200 GPUs at eighty-five percent utilization. The company arrives immediately as a significant player in GPU and power infrastructure, with a Together AI contract worth two hundred seventy million dollars already in place.

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What to Watch Next

TSMC is targeting CoPoS packaging pilot production for twenty twenty-seven and mass production in the second half of twenty twenty-eight. That roadmap is now formalized, and it matters for the chiplet and advanced packaging story as AI model architectures keep demanding more interconnect density.

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